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By Ginkgoem | 14 July 2021 | 0 Comments

Summary of the development history of China's SMT in the first 25 years

The formation and development of SMT
Historically speaking, SMD components SMC/SMD were invented in the mid-1960s by advanced technology countries in Europe and the United States. In the later years, this new type of components was mostly used in thick film circuits and integrated circuits. Print solder paste on the ceramic substrate where the circuits, thick film resistors and pads have been made before, and manually paste the leadless monolithic ceramic capacitor MLC, short pin transistor called "sesame tube" and mount it IC, then reflow soldering to complete the assembly, this is the rudimentary SMT method. Although the academic term ‘SMT’ did not appear at that time, and a separate technical category has not yet been formed, this advanced assembly process with strong vitality has gradually formed.
As early as the early 1980s, the Chinese electronic component academia had paid close attention to the development trend of SMC/SMT in the world, and some components and HIC experts sensitive to new technologies actively compile and write recommended articles.
The earliest introduction of prototype SMT technology in mainland China to produce by hand patching can be traced back to 1982. According to Wang Xingqian, a senior SMC/SMT expert in Shanghai, that year 8
In September, he worked at the Shanghai Radio Sixth Factory, and accompanied the delegation to the British DEK company to investigate the introduction of printing presses, reflow soldering furnaces and process technology, mass production of thick film circuits, and technology upgrades, which significantly improved output and quality. This is the earliest manual placement SMT production method in China that can be verified.
Although the invention of SMC/SMD and the rudimentary SMT technology were first formed in Europe and America, the progress was slow and Japan, which lacked resources but was good at learning from the West and re-innovating technology, accelerated the pace of development and application in the mid-1970s. In the late 1970s, a large Japanese electronics enterprise group took the lead to successfully develop an automatic placement machine, which was gradually improved from internal dedicated equipment to commercialized general-purpose equipment, which was used in the production of household electronic products in large quantities. In the early 1980s, SMT, as a new type of advanced electronic board-level assembly technology, was officially launched due to the breakthrough of the key process equipment for automatic placement. SMT technology has been vigorously developed by focusing on development and competition among large electronic group companies in developed countries. Because SMC/SMD has no leads or short leads, it is convenient to improve the high-frequency performance of electronic products, so it is the earliest and most used color TV electronic tuner with a large amount and a wide range.
In a certain sense, it can be said that the electronic tuner only started the development of SMT, but it did not play a greater role in promoting the development of SMT in the future. The development history of SMT shows that the products that continue to promote the rapid development of SMT are portable communications and IT digital products. Some experts have pointed out that without SMT, there would be no mobile phones, and without mobile phones, there would be no SMT today. Through the research of the development history of mobile phones, the development trajectory of SMT technology can be studied from another angle.
Looking at the history of the development of electronic technology since the first electronic tube was invented, it is believed that the SMT generation of assembly technology has unlimited prospects. Although the miniaturization of RC discrete components has its limits, PCB manufacturing technology will also be greatly improved, IC will be multi-functional and highly integrated, and packaging forms will be diversified. However, SMT technology must be used to assemble it with other components. The components are assembled into the final electronic product.

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