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By ginkgoem | 04 March 2021 | 0 Comments

Working principle of reflow oven

Working principle of reflow oven
The working principle of the preheating zone of the reflow oven:
Preheating is to activate the solder paste, and to avoid the rapid high temperature heating during immersion in the tin, which is a heating action performed to cause defective parts. The goal of this area is to heat the PCB at room temperature as soon as possible, but the heating rate should be controlled within an appropriate range. If it is too fast, it will cause thermal shock, and the circuit board and components may be damaged. If it is too slow, the solvent will not evaporate sufficiently. Welding quality. Due to the faster heating rate, the temperature difference in the reflow furnace at the back of the temperature zone is relatively large. In order to prevent thermal shock from damaging the components, it is generally specified that the maximum heating rate is 4°C/S, and the rising rate is usually set to 1~3°C/S.

Working principle of the cooling zone of the reflow oven:
At this stage, the temperature is cooled to below the solid phase temperature to solidify the solder joints. The cooling rate will have an impact on the strength of the solder joint. If the cooling rate is too slow, it will cause excessive eutectic metal compounds to be produced, and large grain structures are prone to occur at the solder joints, which will reduce the strength of the solder joints. The cooling rate in the cooling zone is generally about 4°C/S, and the cooling rate is 75°C. can.
After brushing the solder paste and mounting the smt chip components, the circuit board is transported through the guide rail of the reflow soldering furnace, and after the action of the four temperature zones above the reflow soldering furnace, a complete soldered circuit board is

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