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LED new light source channel type reflow oven T980

The new LCD touch screen reflow soldering T-980, the reflow soldering furnace has 8 temperature zones, the reflow soldering transmission length is 1160mm, the soldering area is 400*1160mm, the reflow soldering power reaches 7kw
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new LED light sources  reflow oven puhui t980
980 parameter

size and 8 temperature waves included in reflow oven t980
1. Adopt infrared enhanced hot air heating technology, specially designed wind wheel, suitable for continuous batch welding of new LED light sources and BGA components
2. Crawler type, eight-temperature zone heating, independent circulation, independent PID control, independent heating up and down, from room temperature to working temperature ≤20MIN
3. Intelligent curve heating method, ultra-large capacity curve selection, equipped with 8 process curves can fully meet the requirements of various welding processes
4. Programmable control technology, preset curve memory storage function, can automatically complete the entire welding process according to your preset curve;
5. Thermocouple is used for temperature measurement, and a compensation circuit is added to make temperature measurement more accurate and make the curve more perfect
6. PID intelligent temperature control technology makes temperature control more accurate. Imported high current solid state relay non-contact output can effectively avoid chip or circuit board damage caused by rapid heating or uninterrupted heating, making the entire welding process more scientific and safe
7. The transmission system adopts a stepping motor driver to drive the stepping motor transmission, which runs smoothly, and the speed adjustable range is 0-600mm/min;
8. It adopts independent roller structure and topping support, stainless steel B-shaped mesh belt, durable and wear-resistant, running smoothly, and the speed can reach ±10mm/min;
9. The independent cooling zone ensures the low temperature required when the PCB board is out of the board;
10. The powerful touch screen module integrates operation, display and monitoring, making the display more  and easier to operate.
11. The perseverance and steady appearance embodies the technology-based concept from beginning to end. Simple and operation allows you to see it at a glance.

man and machine interface,temperature canbe changed on the led screen
  Machine main interface-room temperature setting interface
1. Click the "Room Temperature Setting" button in the main menu interface to enter the following interface: If you need to calibrate the temperature of the machine, enter the current room temperature in the dialog box when the internal temperature of the standby device is consistent with the room temperature, and click "Save" to complete the calibration. Work at room temperature,
2. Click the "Back" button to enter the main menu interface.
3. Click the "temperature curve" button in the main menu interface, and the system enters the following interface. This interface displays the default eight solder paste welding curves of this machine that meet different types of solder paste. Line users can select the appropriate welding curve according to their own solder paste process requirements, click "Execute", the preheating method dialog box will pop up, and select "Sequence" (each temperature zone will not start at the same time to avoid excessive starting current) or "Synchronize" "(Synchronous start of each temperature zone, full load operation) start, after finishing the selection, click the back button to enter the main menu interface.
4. If you return to the main menu interface and click the "Start heating" button, the preheating method dialog box will pop up, select "Sequence" (each temperature zone will not start at the same time to avoid excessive starting current) or "Synchronize" (each temperature zone (Synchronous start, full load operation) After starting, when the actual operating temperature of the temperature zone exceeds the set temperature of the temperature zone by 20℃, the temperature alarm indicator will flash red and green alternately. The temperature alarm indicator during the heating process and normal temperature control is green. The user can modify the temperature parameters of the curve in this interface. Click the temperature setting dialog box of the temperature zone to be modified, and enter the interface such as to directly modify the parameters.
5. Click the "time setting" button on the main menu interface to enter the following interface: drag the ruler slider left and right or click the text box to input two ways to change the PCB running time (the time the circuit board passes through the heating zone) to change Speed ​​of mesh belt. Click the "Data Test" button to enter the following interface: by clicking the button, a single temperature zone can be turned on or off, the temperature zone is turned on, the button is green, and the temperature zone shutdown button is red. To return to the heating interface, click the "End" button

many hardwares of the new reflow oven t980
  Six, curve setting basis
1. Reflow soldering principle and temperature curve
When the PCB enters the heating zone (dry zone), the solvent and gas in the solder paste will evaporate, and the flux in the solder paste will end button LED new light source welding machine T-980 User Manual Http:// 9/11 Wetting the pads, component ends and pins, the solder paste softens, collapses, and covers the pads, isolating the pads and component pins from oxygen; the PCB enters the heat preservation area, so that the PCB and components are fully pre-prepared Heat to prevent the PCB from suddenly entering the soldering area and heating up too quickly and damaging the PCB and components; when the PCB enters the soldering area, the temperature rises rapidly to make the solder paste reach a molten state, and the liquid solder will cool the PCB pads and the component side PCB Zone, so that the solder joints are solidified, and the entire reflow soldering is completed. The temperature curve is the key to ensuring the quality of soldering. The actual temperature curve and the temperature curve of the solder paste have basically the same heating slope and peak temperature. The heating rate is controlled at about 1°C before 160°C. If the heating slope speed is too fast, on the one hand, the components and PCB will be heated too fast, which will damage the components and cause PCB deformation; on the other hand, the solvent in the solder paste will evaporate too much. Fast and easy to splash out metal components, resulting in solder balls. The peak temperature is generally set at about 20°C-40°C higher than the melting temperature of the solder, and the reflow time is 10S-60S. A low peak temperature or short reflow time will make the soldering insufficient, and in severe cases, the solder paste will not melt; the peak value is too high. High or long reflow time will cause oxidation of metal powder, affect soldering quality, and even damage components and PCB.
2. Setting of temperature curve
Set according to the temperature curve of the solder paste and the soldering principle provided above. Different temperature profiles are used for solder paste with different metal content, and the specific reflow soldering temperature profile is set according to the temperature profile provided by the solder paste manufacturer. In addition, the temperature curve is also related to the heated PCB, the density and size of the components. In general, the temperature of lead-free soldering should be about 40°C higher than the melting point.
Seven, temperature zone setting
1. Set the temperature of the temperature zone and the belt speed to the initial value (generally given by the manufacturer when adjusting the machine).
2. For cold furnaces, preheat for 20-30 minutes.
3. When the temperature reaches equilibrium, the sample PCB is passed through a heating reflow system. Under this setting, the solder paste reaches the critical point of reflow. If the reflow does not occur, follow the process of 4, if the reflow is over-excited, keep the correct ratio and reduce the temperature setting, and let the PCB board pass through the system again until the reflow critical point, go to step 4 if and only if there is no or just reflow occurs. .
4. If reflux does not occur, reduce the belt speed by 5-10%. For example: now the belt speed is 500mm/min when there is no reflux, and it is reduced to about 460mm/min when adjusting. Generally, reducing the belt speed by 10% will increase the product reflow temperature by about 16°C. Or under the premise of not changing the belt speed, increase the set temperature appropriately. The increase is based on the standard temperature curve and adjusted according to the difference between the actual temperature curve and the standard curve when the PCB passes through the system. Generally, it is adjusted every time around 5℃. When adjusting the set temperature, pay special attention not to exceed the bearing capacity of the PCB board and components.
5. Then let the PCB board go through the reflow system at the new belt speed or set temperature, or if no reflow occurs, go and redo the step 4 adjustment, otherwise go to step 6 to fine-tune the temperature curve.
6. The temperature curve can be adjusted appropriately according to the complexity of the PCB. The belt speed can be fine-tuned on the secondary scale, reducing the belt speed will increase the temperature of the product, on the contrary, increasing the belt speed will reduce the temperature of the product.
7. Reminder: Generally, when the PCB with components is not completely reflowed through the reflow system, it can be properly adjusted and then put into the reflow system for soldering. Generally, it will not cause adverse effects on the PCB and components.
8. The temperature setting is generally from low to high. If the temperature range exceeds the reflow temperature too much, the belt speed should be increased or the set temperature should be lowered to adjust. The specific operation is the opposite of 4.



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