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Rework Station T-862 IR BGA Infrared Rework Station reballing kit for ic chips remove mobiles repair machine

Repairing station T-862 suits for Repairing mobile phone mother board and other  less than 25*25mm sizes chips. Infrared BGA Chip Mobile Phone Repairing Soldering station Machine and reballing machine.
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USD
$160.00
$180.00
  • Classification:
    AC110V
    AC220V
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  • Description
  • Reviews(47)
 
 
Infrared bga desoldering station, heating area and applicable range, infrared heating, reduce impact and damage to the circuit board.
  Main component function explanation: 
1.Use of
infrared welding technology which is developed independently.    
2. Use of an
infrared heat lamp. Heat is easy to pierce and distribute evenly, which overcome disadvantage (burn out
components) of traditional welding machines.    
3.
Easy operation. You just need one-day training and you can operate it skillfully.   
4.
No need for unsolder tools. IRDA station T-862 can unsolder all the
componentsbetween 05 and 20mm.   
5.This machine has 650W hot-melt system. Its preheating area is
80x120mm. 6. Infrared heating without heated air flowing. No impact on circumjacent small
components. It is suitable for the components, especially Micro BGA components.

Comparison of parameters of infrared bga desoldering station 862 and 862++
   

The structure and details of the components of the desoldering station
 
 
           T-862 3IN1 digital infrared system,BGA/IRDA/IFR/SMD/SMT STATION
           For more specific operating instructions of the desoldering station 862++,               please refer to ginkgoem's blog:https://www.ginkgoem.com/blog/

  1. Start-up and desoldering:
①. The placement of the circuit board and the adjustment of the height of the lamp body:
②. The temperature setting of the preheating plate:
③, adjust the peak temperature of the lamp body:
④. Selection of different lamp holders.
⑤ Before desoldering the chip, inject a small amount of flux into the bottom or side of the chip
⑥ After a suitable time, the tin point melts and the chip is taken out.
2. Reflow:
①, clean the pad:
②, first plant the solder ball or scrape the BGA chip of the solder paste
③ Turn on the preheating switch to preheat
④. Power on the welded and cooled board to test.
⑤ Use of 936 fast lead-free soldering iron: turn on the power switch, set the required temperature, and turn on the control switch.

Welding product display of infrared desoldering station 862Outer packaging of infrared desoldering station 862Outer packaging of infrared desoldering station 862CE certification of puhui productsInfrared desoldering station 862 after-sales and service
 
    Ginkgoem Puhui T-862 soldering/rework station from Puhui Technologies, an entry level disordering/soldering rework station for surface or hole mount components. With T-862, you get a temperature controlled rework station with all the enhancements including IRDA preheating surface, Infrared centered or dissipated preheating, and Soldering Iron. All controllers are fully digital.    FOR BGA, use the IRDA Ceramic preheating plate and your Infrared light gun for the Mini BGA chips or chips secured by hooks in the middle of the chips, for turbo car chips or controlling speed chips is special to mount, dismount and make controlling boards.    
    This rework station is ESD-Safe and it is made of metal and coated with a static-dissipative paint and allows for Soldering and disordering BGA, Mini BGA, QFP, SOP, PLCC or QFN.  
    THIS IS A GOOD MACHINE FOR MINI LAPTOPS, MEDIUM LAPTOPS AND MINI BOARDS, SPECIALLY MOBILE PHONE ONES OR MAYBE TURBO CHIPS.
    Ginkgoem Repairing station T-862 suits for Repairing mobile phone mother board and other  less than 25*25mm sizes chips. Infrared BGA Chip Mobile Phone Repairing Soldering station Machine and reballing machine.
 


                   

 
Average rating: 5.0 based on 47 reviews
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