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Hand Gun T-835 IR BGA Infrared Rework Station for ic chips repair machine soldering and dissoldering machine similar with hot air gun

Handle Repairing station T-835 suits for Repairing mobile phone mother board, it is better than hot air gun,  the best choice is with preheat plate to assemble a station. Hand Gun T-835  IR BGA Rework Station for ic chips repair machine.
Price:
USD
$160.00
$190.00
  • Classification:
    AC110V
    AC220V
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  • Description
  • Reviews(16)
T-835 adopts a handheld lamp body structure, which is flexible in operation and easy to control. It is suitable for the desoldering of flat components at any angle, especially BGA and SMD components.
 

 

Features:

1. The machine adopts a handheld lamp body structure, which is flexible in operation and easy to control. It is suitable for the desoldering of flat components at any angle, especially BGA and SMD components.

2. Special infrared heating, strong penetrating power, uniform heating of the device, breaking through the traditional hot air desoldering machine to cover the heating , avoiding the disadvantage of greater thermal shock.

3. Infrared heating has no hot air flow and will not affect the surrounding tiny components. BGA, SMD, CSP, LGA, QFP, PLCC and BGA ball planting can be desoldered or reworked, especially BGA and SMD components. At the same time, with the infrared preheating station T-8120, various strips and pin sockets (such as CPU sockets and GAP sockets) can be reworked.

4. Easy to operate, the machine can be fully operated after one day of training. No need for desoldering fixtures, this machine can desolder all flat soldered components.

5. It can fully meet the BGA desoldering/rework requirements of mobile phones, computers, notebooks, and video games.


Special infrared heating, strong penetrating power, uniform heating of the device, breaking through the traditional hot air desoldering machine to cover the heating , avoiding the disadvantage of greater thermal shock.
 

Instructions for use:

1. Turn on and check before turning on

① Check whether the infrared lamp body, temperature sensor and power cord are well connected before turning on.

② Turn on the main power switch. Use it after the self-inspection is completed (the temperature displayed by the digital tube is the current room temperature).

③. A small switch on the front panel is used to control the work of the infrared lamp body; press the "▲" up button and "▼" down button on the front panel to adjust the working temperature of the infrared lamp body within 0-350℃. Press the switch to "ON", the infrared lamp body starts to work, press the switch to "OFF", the infrared lamp body stops working.


 Infrared heating has no hot air flow and will not affect the surrounding tiny components. BGA, SMD, CSP, LGA, QFP, PLCC and BGA ball planting can be desoldered or reworked, especially BGA and SMD components. At the same time, with the infrared preheating station T-8120, various strips and pin sockets (such as CPU sockets and GAP sockets) can be reworked.
 

 Desoldering/rework operations:

(1) The placement of the PCB board: Place the selected PCB board in a suitable working position.

(2) Adjustment and preparation work before desoldering/rework:

① According to the size of the chip and welding process requirements, properly adjust the output temperature of the infrared lamp (0-350°C adjustable). When removing chips smaller than 15x15mm, it can be adjusted to about 160-240℃; when desoldering/reworking chips smaller than 20x20mm, the temperature of the infrared lamp can be adjusted to about 220-240℃; when removing chips larger than 30x30mm, according to the process and user experience, you can Adjust the infrared light to about 240-260°C.

The infrared lamp heat of this machine adopts a stepless adjustment method. You can adjust the temperature freely according to the size of the chip. When the infrared lamp heat adjustment knob is adjusted to the maximum, the infrared light is the strongest and the chip heats up faster. Pay special attention to the temperature control during the welding process. Prevent the sensor from shifting and making the temperature measurement inaccurate, causing the chip to be heated for too long, heating up too high, and burning the chip.

②. Adjust the temperature sensor of the infrared lamp and place it in an appropriate location near the chip or chip. Coat the periphery of the chip and the sensor head with flux (solder treasure or solder oil). This can make the temperature measured by the sensor more accurate, and at the same time have the effect of flux, the BGA pad will be more intact, which can effectively prevent Problems such as sticking and tinting of the pad.


Easy to operate, the machine can be fully operated after one day of training. No need for desoldering fixtures, this machine can desolder all flat soldered components.
 

Desoldering/rework process:

(1) The operation process of disassembly is generally:

① Fix the PCB board;

② Place the temperature sensor of the infrared lamp, apply flux, set the working temperature of the infrared lamp, and turn on the infrared lamp;

③. Adjust the position of the lamp body so that the spot of the infrared lamp body is aimed at the chip to be desoldered/reworked;

④. Adjust the height of the lamp body to keep the height of the lamp cap and the desoldering object 20-30mm. The heating chip reaches the preset temperature or the chip tin plate melts. Use a vacuum pen or tweezers to remove the chip and turn off the infrared light switch.

Put the hand-held lamp body back into the bracket to ensure that the lamp body is fully cooled and prolong the life of the bulb.

⑤ After the host is sufficiently cooled down, turn off the power.

(2) Desoldering/rework of various strips and pin sockets (such as CPU sockets and GAP sockets), (infrared preheating furnace is required):

The general operation is: first cover the heat-resistant parts of the PCB to be desoldered and the components that are not desoldered with aluminum foil, and then fix the PCB to be desoldered, and preset the preheating temperature of the PCB to 160-180°C. Place the temperature sensor next to the desoldering device, turn on the preheated chassis, and after 3-5 minutes or longer, after the desoldering device is evenly heated, it can generally be desoldered. The special infrared lamp can be turned on for auxiliary heating, and the device can be quickly desoldered.

For lead-free devices, the temperature can be increased by 20-30°C.

For double panels, a lower preheating temperature can be used to preheat the PCB board first, and then the top infrared heating can be supplemented.

(3) The operation process of reflow is generally:

The operation process is basically the same as the disassembly process. The difference is: first clean the pads and solder balls, place the chips correctly, and perform preheating, reflow soldering, and cooling according to the process temperature of the solder ball reflow. For lead-free devices, the temperature can be increased by 20-30°C.


It can fully meet the BGA desoldering/rework requirements of mobile phones, computers, notebooks, and video games.
The heat of the infrared lamp of this machine adopts stepless adjustment method, you can freely adjust the temperature according to the size of the chip
 After the PCB board is reflowed/reworked, it shall be cleaned, dried and tested after cooling; if not, it can be reflowed again.
 

 Precautions and related instructions during desoldering/rework:

①. For simple packaged chips, it is recommended to pre-attach aluminum foil to the center of the chip (silicon chip position) to prevent the silicon chip from overheating and bursting. The size of the aluminum foil paper should be slightly larger than the silicon wafer, and it should not be too large, otherwise it will affect the welding effect of the chip. To

② During the desoldering/rework process, all plastic plug-ins in the area irradiated by the infrared lamp should be covered with aluminum foil to prevent deformation or damage during high-temperature infrared baking. But not all packages. To

③After the PCB board has been reflowed/reworked, it shall be cleaned, dried and tested after cooling; if not, it can be reflowed again.

④ Before and after work, do not turn on the infrared lamp for a long time without placing the PCB board. It is strictly forbidden to use the infrared lamp to irradiate highly reflective objects for a long time, otherwise it will seriously affect the life of the lamp.

Average rating: 5.0 based on 16 reviews
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